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Shares of izmo were locked in 5% upper circuit at Rs 709.40 after the company announced that its semiconductor subsidiary izmo Microsystems has made an entry into India’s defence electronics value chain, positioning itself as a provider of advanced semiconductor packaging solutions for mission-critical defence systems.
The company’s technology capabilities are aimed at supporting high-reliability electronics used in radar and sensing platforms, RF and microwave modules for electronic warfare and communications, avionics for airborne platforms, and electronics used in precision-guided systems.
The initiative leverages izmomicro’s advanced semiconductor packaging capabilities, including silicon photonics integration, RF and microwave packaging, and hermetic packaging designed for aerospace and defence environments.
By targeting high-complexity defence electronics where domestic capability remains limited, the company aims to participate in India’s growing push for indigenous defence manufacturing and localisation of critical semiconductor technologies.
izmo is a global provider of automotive digital retail solutions. It operates three synergistic divisions – izmomicro, which offers semiconductor packaging and design solutions; izmocars, which delivers automotive content, digital retail platforms, and virtual reality; and FrogData, which provides AI-driven analytics and decision-making tools for automotive dealerships.
The company's consolidated net profit jumped 93.07% to Rs 11.70 crore on a 0.75% increase in revenue to Rs 59.11 crore in Q3 FY26 as compared with Q3 FY25.
IZMO Ltd, GNG Electronics Ltd, Cambridge Technology Enterprises Ltd and DJ Mediaprint & Logistics Ltd are among the other gainers in the BSE's 'B' group today, 06 February 2026.
Loyal Textile Mills Ltd spiked 18.56% to Rs 301.15 at 12:01 IST. The stock was the biggest gainer in the BSE's 'B' group. On the BSE, 3732 shares were traded on the counter so far as against the average daily volumes of 1196 shares in the past one month.
IZMO Ltd soared 11.41% to Rs 787.75. The stock was the second biggest gainer in 'B' group. On the BSE, 7833 shares were traded on the counter so far as against the average daily volumes of 9013 shares in the past one month.
GNG Electronics Ltd surged 9.99% to Rs 322.1. The stock was the third biggest gainer in 'B' group. On the BSE, 82683 shares were traded on the counter so far as against the average daily volumes of 5202 shares in the past one month.
Cambridge Technology Enterprises Ltd rose 9.98% to Rs 39.13. The stock was the fourth biggest gainer in 'B' group. On the BSE, 3096 shares were traded on the counter so far as against the average daily volumes of 2885 shares in the past one month.
DJ Mediaprint & Logistics Ltd spurt 9.78% to Rs 97.64. The stock was the fifth biggest gainer in 'B' group. On the BSE, 34927 shares were traded on the counter so far as against the average daily volumes of 47131 shares in the past one month.
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This achievement leverages an advanced 3D SiP architecture with stacked substrates to meet the reliability standards required for space-grade electronics.
By re-engineering traditional the 200 mm × 200 mm PCB-based electronics into a compact 81 mm × 81 mm SiP module, izmo Microsystems has realized an 84% reduction in footprint. This is achieved through the integration of active components in bare-die form onto a stacked-substrate configuration using high-density wire bonding. This approach enables high routing density and multi-function integration while maintaining the compact dimensions necessary for space-constrained environments.
The module is enclosed in a fully indigenized custom Hermetic Ceramic Package, designed and fabricated in India. This hermetic solution is engineered for the environmental robustness and long-term performance essential for the extreme thermal and vacuum conditions of space. Mastering this level of integration is a significant technical hurdle, as it requires managing high-density signal integrity and thermal dissipation within a small volume.
This achievement represents a major advancement in India's semiconductor mission and the 'Make in India' initiative. While standard SiP solutions typically focus on commercial electronics, izmo Microsystems' achievement represents a shift into advanced 3D heterogeneous integration for space electronics.
Dinanath Soni, Executive Director of izmo Microsystems, stated: 'The successful realization of this 3D SiP module validates our technical roadmap and our ability to execute on highly complex semiconductor packaging requirements. By migrating space electronics to integrated 3D architectures, we provide a viable solution for the 'NewSpace' industry where mass and volume reduction are critical factors. This achievement confirms our end-to-end competency in space-grade miniaturization and our commitment to building high-value intellectual property within India.'