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Kerala Blasters FC partners with MosChip Technologies as the Club's Official Technology Partner for the 2025-26 season. The collaboration will support the Club's growing focus on integrating technology into athlete performance and wellbeing.
As a part of the association, MosChip will support Kerala Blasters FC's technology-driven initiatives and help strengthen the Club's digital and innovation-led ecosystem.
The partnership will see Kerala Blasters FC and MosChip co-develop an athlete performance application that turns wearable data into context-aware, personalized insights on player health, readiness, and recovery at both team and individual levels - built on MosChip's AgenticSky WearableCore accelerator, with role-based access for coaches and players.
MosChip Technologies announced the successful silicon bring-up of SAC's custom SoC in 28nm technology node, completing an end-to-end turnkey ASIC program from Netlist to packaged silicon.
Following tape out with its proven Netlist to GDSII flow and methodology, MosChip did substrate design for 10 Layer FC-CBGA package and Assembly and validated engineering samples on ATE, confirming functionality against specification.
Space Applications Centre (SAC) is a premier research and development institution under the Indian Space Research Organization (ISRO), with multi-disciplinary expertise in satellite technology and space-borne applications. As a leading center of excellence, SAC specializes in designing and developing innovative satellite systems for earth observation, communication, navigation, and scientific research, serving both national and international stakeholders. With its world-class facilities and technological innovation, SAC continues to advance space science and applications for societal benefit.
The program exemplifies MosChip's integrated Turnkey ASIC capability. MosChip managed every critical phase - DFT architecture; DFT implementation and verification; full-chip physical design and signoff; RDL design and routing; package design; tester board design; and post silicon bring-up and validation - reducing interface risk between phases, compressing timelines, and ensuring cohesive execution across silicon, packaging, and test. Packaged silicon has been delivered and validated, enabling SAC to proceed to the next stage of productization.
MosChip Technologies today announced its role in supporting EMASS's ECS-DoT Edge AI System on-Chip (SoC), an ultra-low-power chip designed for always-on intelligence in wearables, drones, industrial IoT, and edge sensors.
EMASS led the ECS-DoT's architecture design and set ambitious targets for performance and energy efficiency, aiming for up to 93% faster processing and 90% lower energy use compared to conventional edge AI solutions. To support this effort, MosChip provided engineering services for the silicon implementation in 22nm technology - contributing to physical design flows, tape-out coordination, packaging, assembly, evaluation hardware, and validation activities. The collaboration enabled a fully functional SoC and evaluation platform.
MosChip Technologies announced that it will launch its new ProductXcelerate™ Blueprints at Embedded World North America, introducing a unified solutions suite that advances how OEMs design intelligent, connected products in the AI-Led Product Era.
As OEMs accelerate intelligent product development, integration challenges persist across hardware, software, and digital & AI lifecycles.
MosChip's Integrated Engineering approach eliminates these barriers - aligning hardware, embedded software, digital and AI engineering design under a single, co-engineered lifecycle.
ProductXcelerate™ Blueprints are pre-validated, SMARC-aligned, vertical-ready reference designs that unify validated hardware platforms, embedded software stacks, MosChip DigitalSky GenAIoT™ modules, and AgenticSky™ cores - built to meet compliance, interoperability, and scalability requirements, enabling OEMs to design once, certify once, and scale confidently across product lines.
MosChip DigitalSky GenAIoT™ delivers connectivity and intelligence through edge-cloud orchestration, analytics, and intelligent automation, while AgenticSky™ cores (VisionCore, HMICore, WearableCore, ControllerCore) introduce Agentic AI traits - goal-orientation, adaptiveness, and autonomy - allowing machines, devices, and edge systems to sense, decide, and act predictably in the field.
Together, they define a seamless path from hardware to agentic AI, helping engineering teams accelerate development, simplify validation, and ensure long-term reliability.
EBITDA stood at Rs 16.74 crore, recording the growth of 9% compared with Rs 18.24 crore posted in same quarter last year. EBITDA margin improved to 13.2% in Q2 FY26 as against 12.3% in Q2 FY25.
To support growing business needs, the company is expanding its footprint in Bangalore and Pune by moving into larger office spaces. These new locations are strategically chosen to be closer to key social infrastructure, offering improved convenience and accessibility for the company’s employees.
Moschip Technologies, headquartered in Hyderabad, India, specializing in semiconductor and product engineering solutions. It offers engineering solutions comprising of systems and product design, IoT solution design, artificial intelligence and machine learning, FPGA design, mixed signal IP design, ASIC design, design verification, and validation.
The scrip rose 0.44% to Rs 264.75 in the BSE.